The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 13, 2008
Filed:
Jun. 13, 2006
Daoqiang LU, Chandler, AZ (US);
Jiamiao Tang, Shanghai, CN;
Jiangqi He, Gilbert, AZ (US);
Edward A. Zarbock, Gilbert, AZ (US);
Daoqiang Lu, Chandler, AZ (US);
Jiamiao Tang, Shanghai, CN;
Jiangqi He, Gilbert, AZ (US);
Edward A. Zarbock, Gilbert, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
A chip-to-chip optical interconnect includes a substrate, an optoelectronic die, and a waveguide structure. The substrate includes an optical via passing through the substrate. The optoelectronic die is disposed on the substrate and aligned to optically communicate through the optical via. A waveguide structure is positioned proximate to the substrate and aligned with the optical via to communicate optical signals with the optoelectronic die through the optical via.