The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7371467 B1

PDF
Full Text
Expired
Date of Patent:
May. 13, 2008

Filed:

Apr. 13, 2004
Applicants:

Nianci Han, San Jose, CA (US);

LI Xu, San Jose, CA (US);

Hong Shih, Walnut, CA (US);

Yang Zhang, Albany, CA (US);

Danny LU, Milpitas, CA (US);

Jennifer Y. Sun, Sunnyvale, CA (US);

Inventors:

Nianci Han, San Jose, CA (US);

Li Xu, San Jose, CA (US);

Hong Shih, Walnut, CA (US);

Yang Zhang, Albany, CA (US);

Danny Lu, Milpitas, CA (US);

Jennifer Y. Sun, Sunnyvale, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 15/04 (2006.01); B32B 15/20 (2006.01); B01J 19/02 (2006.01); B05C 11/00 (2006.01); G03F 7/16 (2006.01);
U.S. Cl.
CPC ...
Abstract

A component capable of being exposed to a plasma in a process chamber has a structure having an electroplated coating comprising yttrium-containing species. The electroplated coating is resistant to corrosion in the plasma, and can have a compositional gradient of yttrium-containing species through a thickness of the coating. In one embodiment, the coating is formed by electroplating a layer comprising yttrium onto the surface, and then electroplating a second layer onto the first layer, and annealing the first and second layers. The second layer can comprise aluminum or zirconium. In another embodiment, the coating is formed by electroplating a layer comprising a mixture of aluminum and yttrium onto the surface and annealing the layer.


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