The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 29, 2008
Filed:
Jan. 03, 2007
Jeng-yuan Lai, Taichung Hsien, TW;
Chun-lung Chen, Taichung Hsien, TW;
Jeng-Yuan Lai, Taichung Hsien, TW;
Chun-Lung Chen, Taichung Hsien, TW;
Abstract
A semiconductor package and a fabrication method thereof are proposed. A lead frame is provided between a chip and a substrate in a window ball grid array semiconductor package, wherein an active surface of the chip is electrically connected to the lead frame via bonding wires formed in an opening of the substrate and is electrically connected to the substrate via the lead frame. The provision of lead frame can improve the heat dissipating efficiency and electrical performances. The bonding wires located in the opening of the substrate eliminate the prior-art drawback of requiring different molds in response to different opening structures of a substrate.