The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 29, 2008
Filed:
May. 18, 2005
James P. Mellody, Phoenix, AZ (US);
Sabina J. Houle, Phoenix, AZ (US);
James P. Mellody, Phoenix, AZ (US);
Sabina J. Houle, Phoenix, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
A method and an arrangement to bond a die to a substrate of a die-substrate combination to form a microelectronic package. The method comprises: providing the die-substrate combination including a die, a substrate, pre-connection bumps and an underfill material, the pre-connection bumps and underfill material being disposed between the die and the substrate; forming joints from the pre-connection bumps at a joint formation site to obtain an intermediate package; curing the underfill material of the intermediate package at an underfill curing site to obtain the microelectronic package; using a conveying device to transfer the intermediate package from the joint formation site to the underfill curing site; and applying heat energy to the intermediate package during at least part of a transfer thereof from the joint formation site to the underfill curing site to control a temperature of the intermediate package.