The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 29, 2008

Filed:

Feb. 28, 2007
Applicants:

Wataru Sakurai, Kanagawa, JP;

Kazuhito Saito, Kanagawa, JP;

Hideo Numata, Tokyo, JP;

Chiaki Takubo, Tokyo, JP;

Hideto Furuyama, Tokyo, JP;

Hiroshi Hamasaki, Tokyo, JP;

Inventors:

Wataru Sakurai, Kanagawa, JP;

Kazuhito Saito, Kanagawa, JP;

Hideo Numata, Tokyo, JP;

Chiaki Takubo, Tokyo, JP;

Hideto Furuyama, Tokyo, JP;

Hiroshi Hamasaki, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/36 (2006.01);
U.S. Cl.
CPC ...
Abstract

When a resinto form a molded bodyis poured and a lead frameis attached to a front end faceof the molded bodyby insert molding, protective leadsprovided on both outsides of a lead patternof the lead framemoderate the flow of the resinand the force acting on the lead patternis decreased, so that misregistration of the lead patterncan be prevented. Accordingly, the inserted and molded lead framecan be wired on the front end faceof the molded bodyfor easily accomplishing three-dimensional electric wiring.


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