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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7361991 B1

PDFFull Text
Expired
Date of Patent:
Apr. 22, 2008

Filed:

Sep. 19, 2003

Closed air gap interconnect structure

Applicants:

Katherine L Saenger, Ossining, NY (US);

Maheswaran Surendra, Croton-on-Hudson, NY (US);

Anna Dorothy Karecki, Legal Representative, Brooklyn, NY (US);

Satya V Nitta, Poughquag, NY (US);

Sampath Purushothaman, Yorktown Heights, NY (US);

Matthew E Colburn, Hopewell Junction, NY (US);

Timothy J Dalton, Ridgefield, CT (US);

Elbert Huang, Tarrytown, NY (US);

Inventors:

Katherine L Saenger, Ossining, NY (US);

Maheswaran Surendra, Croton-on-Hudson, NY (US);

Anna Dorothy Karecki, legal representative, Brooklyn, NY (US);

Satya V Nitta, Poughquag, NY (US);

Sampath Purushothaman, Yorktown Heights, NY (US);

Matthew E Colburn, Hopewell Junction, NY (US);

Timothy J Dalton, Ridgefield, CT (US);

Elbert Huang, Tarrytown, NY (US);

Assignee:

International Business Machines Corporation, Armonk, NY (US);

Attorneys:

Ohlandt, Greeley, Ruggiero & Perle, L.L.P.

Daniel P. Morris, Esq.

Primary Examiner:

Alexander Oscar Williams

Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
Abstract

A closed air gap interconnect structure is described. The structure includes discrete regions of a permanent support dielectric under the interconnect lines so that the lines are substantially surrounded by air except for the discrete regions of the support dielectric and the optional interconnect vias located underneath. The lines and the lateral gap between them are straddled on top by a cap layer so that a closed air gap is formed. Several embodiments of this structure and methods to fabricate the same are also described.

Find Patent Forward Citations

Saenger, Katherine. (2008). Closed air gap interconnect structure (U.S. Patent No. 7361991). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7361991

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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