The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 22, 2008
Filed:
Feb. 25, 2003
Hiroo Koyanagi, Tokyo, JP;
Koji Nakayama, Saitama, JP;
Chie Umeyama, Saitama, JP;
Yoshihiro Kawada, Saitama, JP;
Minoru Yokoshima, Ibaraki, JP;
Hiroo Koyanagi, Tokyo, JP;
Koji Nakayama, Saitama, JP;
Chie Umeyama, Saitama, JP;
Yoshihiro Kawada, Saitama, JP;
Minoru Yokoshima, Ibaraki, JP;
Nippon Kayaku Kabushiki Kaisha, Tokyo, JP;
Abstract
A photosensitive resin (A) consisting substantially of a product obtained by reacting a polyester (c) which is a reaction product of a polyol (a) with a tetrabasic acid dianhydride (b) with a compound (d) having an ethylenically unsaturated group and an epoxy group in the molecule; an alkali-soluble photosensitive resin (AA) obtained by reacting the photosensitive resin (A) with a di- or tri-basic acid mono-anhydride (e); photosensitive resin compositions prepared by incorporating the above photosensitive resin with a diluent (XX), a crosslinking agent (B) and/or a photopolymerization initiator (C); products of curing of the compositions; and articles equipped with these products. The resins and resin compositions give cured articles which are suitable for the formation of optical waveguides and excellent in processability, transparency, developability, close adhesion, resistance to soldering heat, and so on.