The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 01, 2008
Filed:
Aug. 28, 2006
Shih-ping Hsu, Hsin-chu, TW;
Sao-hsia Tang, Hsin-chu, TW;
Ying-tung Wang, Hsin-chu, TW;
Wen Hung HU, Hsin-chu, TW;
Chao Wen Shih, Hsin-chu, TW;
Shih-Ping Hsu, Hsin-chu, TW;
Sao-Hsia Tang, Hsin-chu, TW;
Ying-Tung Wang, Hsin-chu, TW;
Wen Hung Hu, Hsin-chu, TW;
Chao Wen Shih, Hsin-chu, TW;
Phoenix Precision Technology Corporation, Hsin-Chu, TW;
Abstract
A method for fabricating a circuit board having a conductive structure is disclosed. The method includes: forming first and second insulating protective layers respectively on first and second surfaces of a circuit board; forming a conductive layer on the first insulating protective layer and the openings; forming first and second resist layers on the conductive layer and the second insulating protective layer respectively; forming first electrically connecting structures by electroplating on the exposed conductive layer over a plurality of first and second electrically connecting pads in openings of the first resist layer; removing the first and the second resist layers and the conductive layer covered by the first resist layer; and forming second electrically connecting structures by stencil printing on the conductive layer over the second electrically connecting pads on the first surface and on a plurality of third electrically connecting pads of the second surface of the circuit board.