The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 25, 2008
Filed:
Dec. 21, 2005
Applicants:
Qing A. Zhou, Chandler, AZ (US);
Wei O. Shi, Gilbert, AZ (US);
Jiangqi He, Gilbert, AZ (US);
Daoqiang LU, Chandler, AZ (US);
Inventors:
Qing A. Zhou, Chandler, AZ (US);
Wei O. Shi, Gilbert, AZ (US);
Jiangqi He, Gilbert, AZ (US);
Daoqiang Lu, Chandler, AZ (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 21/00 (2006.01); B23K 31/02 (2006.01);
U.S. Cl.
CPC ...
Abstract
A system may include a microprocessor die, an integrated circuit package substrate, and a die disposed between the microprocessor die and the integrated circuit package substrate. In some embodiments, the integrated circuit package substrate defines a first cavity, and the die is disposed at least partially within the first cavity.