The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 25, 2008

Filed:

Dec. 21, 2005
Applicants:

Qing A. Zhou, Chandler, AZ (US);

Wei O. Shi, Gilbert, AZ (US);

Jiangqi He, Gilbert, AZ (US);

Daoqiang LU, Chandler, AZ (US);

Inventors:

Qing A. Zhou, Chandler, AZ (US);

Wei O. Shi, Gilbert, AZ (US);

Jiangqi He, Gilbert, AZ (US);

Daoqiang Lu, Chandler, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 21/00 (2006.01); B23K 31/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

A system may include a microprocessor die, an integrated circuit package substrate, and a die disposed between the microprocessor die and the integrated circuit package substrate. In some embodiments, the integrated circuit package substrate defines a first cavity, and the die is disposed at least partially within the first cavity.


Find Patent Forward Citations

Zhou, Qing. (2008). Integrated circuit package to provide high-bandwidth communication among multiple dice (U.S. Patent No. 7348678). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7348678

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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