The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 11, 2008
Filed:
May. 24, 2006
Junichi Tanaka, Tsuchiura, JP;
Hiroyuki Kitsunai, Chiyoda, JP;
Akira Kagoshima, Kudamatsu, JP;
Daisuke Shiraishi, Kudamatsu, JP;
Hideyuki Yamamoto, Kudamatsu, JP;
Shoji Ikuhara, Hikari, JP;
Toshio Masuda, Toride, JP;
Junichi Tanaka, Tsuchiura, JP;
Hiroyuki Kitsunai, Chiyoda, JP;
Akira Kagoshima, Kudamatsu, JP;
Daisuke Shiraishi, Kudamatsu, JP;
Hideyuki Yamamoto, Kudamatsu, JP;
Shoji Ikuhara, Hikari, JP;
Toshio Masuda, Toride, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
A semiconductor processing apparatus for processing a semiconductor wafer includes a plurality of sensors for monitoring a processing state, a processing result input unit, a model equation generation unit to generate a model equation for predicting a processing result, a processing result prediction unit which predicts a processing result, and a process recipe control unit. Further, a system is provided which comprises the model equation generation unit is provided at a remote location, and transmits the generated prediction model equation to the semiconductor processing apparatus through a network to control the processing condition of the semiconductor processing apparatus by the process recipe control unit.