The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 04, 2008

Filed:

Jul. 13, 2005
Applicants:

Young-kyu Lim, Gyeonggi-do, KR;

Byung-am Lee, Gyeonggi-do, KR;

Byung-seol Ahn, Gyeonggi-do, KR;

Jae-sun Cho, Gyeonggi-do, KR;

Chang-hoon Lee, Chungcheongnam-do, KR;

Jung-lan Lee, Busan, KR;

Sung-man Lee, Gyeonggi-do, KR;

Inventors:

Young-Kyu Lim, Gyeonggi-do, KR;

Byung-Am Lee, Gyeonggi-do, KR;

Byung-Seol Ahn, Gyeonggi-do, KR;

Jae-Sun Cho, Gyeonggi-do, KR;

Chang-Hoon Lee, Chungcheongnam-do, KR;

Jung-Lan Lee, Busan, KR;

Sung-Man Lee, Gyeonggi-do, KR;

Assignee:

Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01N 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method and apparatus of classifying repetitive defects on a substrate is provided. Defects of dies on the substrate are sequentially compared with a predetermined reference die. Sets of coordinates are marked on the reference die which are corresponding to the position of the defects on the dies on the substrate. Then, repetitive defects are classified which are repeatedly marked in a specified region on the reference die.


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