The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 04, 2008
Filed:
Sep. 29, 2004
Jose Omar Rodriguez, Orlando, FL (US);
Charles A. Storey, Orlando, FL (US);
Andres B. Garcia, Ocoee, FL (US);
Margareth Seputro, Orlando, FL (US);
Frank Miceli, Orlando, FL (US);
Jose Omar Rodriguez, Orlando, FL (US);
Charles A. Storey, Orlando, FL (US);
Andres B. Garcia, Ocoee, FL (US);
Margareth Seputro, Orlando, FL (US);
Frank Miceli, Orlando, FL (US);
Agere Systems Inc., Allentown, PA (US);
Abstract
A method and system are provided using an offset dial gage for alignment and adjustment of a polishing pad that has been attached to a turntable of a chemical mechanical polishing (CMP) device. In a described embodiment, an offset dial gage has a surface that contacts a side of a turntable, while a sensor tip contacts the edge of a polishing pad positioned on the turntable. This provides an assessment of radial displacement of the polishing pad edge at this measurement point relative to the side of the turntable. Based on one or more such measurements, the polishing pad may be found acceptably positioned, may be trimmed, or may be replaced. The method and system reduce or eliminate the occurrence of a defect pattern found to be related to side unloading of semiconductor wafers from a CMP turntable.