The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 19, 2008
Filed:
Nov. 29, 2004
Applicants:
Yen Chuang, Taipei, TW;
Ming-sen Chen, Hsinchu, TW;
Inventors:
Yen Chuang, Taipei, TW;
Ming-Sen Chen, Hsinchu, TW;
Assignee:
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 19/00 (2006.01); H01L 21/302 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method of predicting CMP removal rate for CMP process in a CMP process tool. The method predicts CMP removal rates for CMP processes without polishing additional control wafers. The CMP process performed by the CMP process tool can be easily transferred accordingly, such that uptime of the CMP process tool is increased. In addition, number of control wafers used and production costs are also reduced.
Chuang, Yen. (2008). Method of predicting cmp removal rate for cmp process in a cmp process tool in order to determine a required polishing time (U.S. Patent No. 7333875). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7333875
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile