The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 19, 2008

Filed:

Feb. 27, 2004
Applicants:

Shuji Yamaoka, Fukuyama, JP;

Akira Nurioka, Fukuyama, JP;

Mishio Hayashi, Saitama, JP;

Shogo Ishioka, Hiroshima, JP;

Inventors:

Shuji Yamaoka, Fukuyama, JP;

Akira Nurioka, Fukuyama, JP;

Mishio Hayashi, Saitama, JP;

Shogo Ishioka, Hiroshima, JP;

Assignee:

OHT Inc., Hiroshima, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 31/08 (2006.01); G01R 31/302 (2006.01);
U.S. Cl.
CPC ...
Abstract

Disclosed is a conductor inspection apparatus capable of detecting a state of an inspection-target electric conductor with a high degree of accuracy in a non-contact manner. The inspection apparatus includes a signal supply sectionfor supplying an inspection signal to an inspection-target conductor, and two sensor platesdisposed approximately parallel to each other in the vicinity of the conductor. The inspection apparatus is designed to inspect a configuration of the conductordisposed opposed to the sensor plate, in accordance with a measured signal level from the sensor plate. The inspection apparatus further includes a subtracterfor subjecting respective detected signal values from the sensor platesto subtraction, and a dividerfor dividing the detected signal value from a selected one of the sensor plates by the subtraction result to normalize the detected signal value from the selected sensor plate so as to detect a relative ratio between the detected signal values from the sensor plates to obtain a value X corresponding a distance between the selected sensor plate and the conductor, as a detection result.


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