The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 12, 2008

Filed:

Jan. 31, 2005
Applicants:

Ker-min Chen, Hsinchu, TW;

Tsung-yang Hung, Jhubei, TW;

Inventors:

Ker-Min Chen, Hsinchu, TW;

Tsung-Yang Hung, Jhubei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04B 1/40 (2006.01);
U.S. Cl.
CPC ...
Abstract

In one embodiment, the disclosure relates to a method and apparatus for inter-chip wireless communication system. The system includes a first microprocessor having a plurality of non-contact ports and a first RF communication circuit integrated with the first microprocessor; a second microprocessor also having a plurality of non-contact ports and a second RF communication circuit integrated therein. An RF communication protocol can be configured to receive data from each of the non-contact ports in parallel, multiplex and translate the data to a serial RF signal. Data communication can be accomplished using the wireless communication circuit on each chip. The RF communication between the first and the second integrated circuits using the communication protocol defines a non capacitive-coupling of the first and the second die.


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Chen, Ker-Min. (2008). Method and apparatus for inter-chip wireless communication (U.S. Patent No. 7330702). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7330702

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