The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 12, 2008
Filed:
Feb. 01, 2005
Warren M. Farnworth, Nampa, ID (US);
Steven M. Mcdonald, Star, ID (US);
Warren M. Farnworth, Nampa, ID (US);
Steven M. McDonald, Star, ID (US);
Micron Technology, Inc., Boise, ID (US);
Abstract
A semiconductor component configured for wafer-level testing includes a semiconductor die having at least one die contact electrically exposed for coupling with a redistribution circuit that electrically couples at least one die contact to an extended contact such as a bumped contact. A wafer-level redistribution circuit interconnects a plurality of dice and includes a redistribution circuit for coupling between a die contact on one of the dice and a corresponding bumped contact. The wafer-level redistribution circuit further includes a bus conductor traversing each of the plurality of dice for electrically coupling with at least another one of the plurality of dice. At least one other conductor couples the redistribution circuit to the bus conductor.