The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 05, 2008

Filed:

Jul. 18, 2005
Applicants:

Krishnan Shrinivasan, San Jose, CA (US);

Stephen Gentile, Sunnyvale, CA (US);

Peter Woytowitz, Mountain View, CA (US);

Sassan Roham, San Ramon, CA (US);

George Kamian, Scotts Valley, CA (US);

Inventors:

Krishnan Shrinivasan, San Jose, CA (US);

Stephen Gentile, Sunnyvale, CA (US);

Peter Woytowitz, Mountain View, CA (US);

Sassan Roham, San Ramon, CA (US);

George Kamian, Scotts Valley, CA (US);

Assignee:

Novellus Systems, Inc., San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A21B 2/00 (2006.01); C23C 16/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention provides a heat transfer assembly that, when coupled to an object, is capable of keeping the object at a uniform elevated temperature while removing large amounts of heat from an external source. The assembly may be contained in a pedestal for use in a UV-cure chamber. The heat transfer assembly includes a heating element to control the wafer temperature and a cooling element to remove incident IR heat from the wafer and pedestal. A heat resistant layer having a calibrated heat resistance is located between the heating and cooling elements and between the wafer and the cooling elements. The heat resistant layer is able to sustain high temperature gradient from the wafer to the coolant so that the coolant does not boil while permitting enough heat to be conducted away from the wafer to maintain the desired set-point temperature.

Published as:

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