The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 01, 2008
Filed:
Jun. 30, 2005
Applicants:
Fay Hua, Fremont, CA (US);
Albert T. Wu, Taoyuan, TW;
Kevin Jeng, Cupertino, CA (US);
Krishna Seshan, San Jose, CA (US);
Inventors:
Fay Hua, Fremont, CA (US);
Albert T. Wu, Taoyuan, TW;
Kevin Jeng, Cupertino, CA (US);
Krishna Seshan, San Jose, CA (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
Abstract
A ball-limiting metallurgy (BLM) stack is provided for an electrical device. The BLM stack resists tin migration toward the metallization of the device. A solder system is also provided that includes a eutectic-Pb solder on a substrate that is mated to a high-Pb solder, and that withstands higher temperature reflows and other higher temperature processes.