The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 25, 2007

Filed:

Sep. 10, 2004
Applicants:

Naoki Takayama, Nirasaki, JP;

Bin Wang, Nirasaki, JP;

Satoshi Harada, Nirasaki, JP;

Inventors:

Naoki Takayama, Nirasaki, JP;

Bin Wang, Nirasaki, JP;

Satoshi Harada, Nirasaki, JP;

Assignee:

Tokyo Electron Limited, Tokyo-To, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06F 17/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

With analysis data in the prior art, it is difficult to find out if a change regarded as a judgmental standard of the completion of seasoning has come from a change due to the seasoning, namely, change in condition of the interior of a processing container or come from another change based on a temperature change among respective dummy wafers and furthermore, it is difficult to judge whether the seasoning has been completed or not. Therefore, a plasma processing method of the present invention, which is a method for detecting the completion of seasoning in performing the seasoning by loading dummy wafers W into a processing containerof a plasma processing apparatusincludes a process of creating a predictive formula for predicting the completion of seasoning and another process of detecting the completion of seasoning in performing the seasoning, based on the predictive formula. The creation of the predictive formula is accomplished by performing a multivariate analysis against a plurality of measured data that can be obtained by first supplying dummy wafers W into the processing containercooling down the interior of the processing containerand supplying a plurality of dummy wafers W into the processing containeragain.


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