The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 25, 2007
Filed:
Oct. 18, 2001
Ashay A. Dani, Chandler, AZ (US);
Paul A. Koning, Chandler, AZ (US);
Saikumar Jayaraman, Chandler, AZ (US);
Christopher L. Rumer, Chandler, AZ (US);
Ashay A. Dani, Chandler, AZ (US);
Paul A. Koning, Chandler, AZ (US);
Saikumar Jayaraman, Chandler, AZ (US);
Christopher L. Rumer, Chandler, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
A thermal interface material is described for thermal coupling of an electronic component to a thermally conductive member. The thermal interface material includes a viscoelastic polymer matrix material, fusible solder particles in the matrix material, and filler particles in the matrix material. The solder particles have a melting temperature below a selected temperature (e.g. 157° C. for indium) and the filler particles have a melting temperature substantially above the selected temperature (e.g. 961° C. for silver). The filler particles keep the thermal interface material intact under adverse thermal and stress conditions.