The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 04, 2007
Filed:
Jul. 01, 2004
Applicants:
Francis J. Kelley, Bear, DE (US);
John Quanci, Haddonfield, NJ (US);
Joseph K. SO, Newark, DE (US);
Hongyu Wang, Wilmington, DE (US);
Inventors:
Francis J. Kelley, Bear, DE (US);
John Quanci, Haddonfield, NJ (US);
Joseph K. So, Newark, DE (US);
Hongyu Wang, Wilmington, DE (US);
Assignee:
Rohm and Haas Electronic Materials CMP Holdings, Inc., Newark, DE (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09G 1/02 (2006.01); C09G 1/04 (2006.01); H01L 21/304 (2006.01); H01L 21/461 (2006.01);
U.S. Cl.
CPC ...
Abstract
The present invention provides an aqueous composition useful for CMP of a semiconductor wafer containing a metal comprising oxidizer, inhibitor for a nonferrous metal, complexing agent for the nonferrous metal, modified cellulose, 0.001 to 10% by weight copolymer blends of a first copolymer and a second copolymer and balance water.