The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 04, 2007
Filed:
Oct. 12, 2006
Brian Samuel Beaman, Apex, NC (US);
Joseph Kuczynski, Rochester, MN (US);
Theron Lee Lewis, Rochester, MN (US);
Amanda Elisa Ennis Mikhail, Rochester, MN (US);
Arvind Kumar Sinha, Rochester, MN (US);
Brian Samuel Beaman, Apex, NC (US);
Joseph Kuczynski, Rochester, MN (US);
Theron Lee Lewis, Rochester, MN (US);
Amanda Elisa Ennis Mikhail, Rochester, MN (US);
Arvind Kumar Sinha, Rochester, MN (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
The illustrative embodiments provide a socket, a method for manufacturing the socket, a device, and a method for compensating for a difference in the coefficients of thermal expansion between a socket and a printed circuit board. The socket includes surface mounted contacts and an elongated housing. The elongated housing comprises an aperture, wherein the surface mounted contacts extend from the aperture. At least one plate connects to the elongated housing, wherein the at least one plate has a coefficient of thermal expansion selected to compensate for a difference in coefficients of thermal expansion between the socket and a printed circuit board.