The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 27, 2007
Filed:
Dec. 07, 2001
Applicants:
Hong-sik Jeong, Kyungki-do, KR;
Soo-ho Shin, Seoul, KR;
Won-suk Yang, Kyungki-do, KR;
Ki-nam Kim, Kyungki-do, KR;
Inventors:
Hong-sik Jeong, Kyungki-do, KR;
Soo-ho Shin, Seoul, KR;
Won-suk Yang, Kyungki-do, KR;
Ki-nam Kim, Kyungki-do, KR;
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/31 (2006.01); H01L 21/469 (2006.01); H01L 21/3205 (2006.01); H01L 21/4763 (2006.01); H01L 21/336 (2006.01);
U.S. Cl.
CPC ...
Abstract
An integrated circuit device is manufactured by forming an insulating layer on a substrate. A capping layer is formed on the insulating layer and both the capping layer and the insulating layer are patterned. Insulating spacers are formed on sidewalls of the insulating layer so that the insulating spacers, the capping layer, and the substrate enclose the insulating layer.