The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 23, 2007
Filed:
Aug. 05, 2005
Applicants:
Pak Hong Yee, Pandan Valley, SG;
Wuu Yean Tay, Singapore, SG;
Inventors:
Pak Hong Yee, Pandan Valley, SG;
Wuu Yean Tay, Singapore, SG;
Assignee:
Micron Technology, Inc., Boise, ID (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 31/02 (2006.01);
U.S. Cl.
CPC ...
Abstract
A testing apparatus and method for testing integrated circuits is disclosed wherein a device under test is continuously maintained at a desired set point temperature by an included thermal body. The thermal body has an enclosed phase change material which provides latent heat to the device under test such that there is negligible temperature variation realized by integrated circuits being tested.
Yee, Pak. (2007). Integrated circuit (ic) test assembly including phase change material for stabilizing temperature during stress testing of integrated circuits and method thereof (U.S. Patent No. 7285971). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7285971
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile