The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 23, 2007
Filed:
Jan. 14, 2004
Masahiro Sunohara, Nagano, JP;
Kei Murayama, Nagano, JP;
Mitsutoshi Higashi, Nagano, JP;
Toshinori Koyama, Nagano, JP;
Masahiro Sunohara, Nagano, JP;
Kei Murayama, Nagano, JP;
Mitsutoshi Higashi, Nagano, JP;
Toshinori Koyama, Nagano, JP;
Shinko Electric Industries Co., Ltd., Nagano, JP;
Abstract
The present invention includes the steps of forming a first resin film uncured on a wiring substrate including a wiring pattern, burying an electronic parts having a connection terminal on an element formation surface in the first resin film uncured in a state where the connection terminal is directed upward, forming a second resin film for covering the electronic parts, obtaining an insulation film by curing the first and second resin films by heat treatment, forming a via hole in a predetermined portion of the insulation film on the wiring pattern and the connection terminal, and forming an upper wiring pattern connected to the wiring pattern and the connection terminal through the via hole, on the insulation film.