The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 16, 2007
Filed:
Oct. 31, 2003
Masahiko Hirata, Kashiba, JP;
Hisahiko Yoshida, Ibaraki, JP;
Takashi Nagashima, Kyoto, JP;
Toshihiko Taguchi, Saitama, JP;
Yoshitaka Toyoda, Satte, JP;
Tsukasa Ohnishi, Souka, JP;
Masahiko Hirata, Kashiba, JP;
Hisahiko Yoshida, Ibaraki, JP;
Takashi Nagashima, Kyoto, JP;
Toshihiko Taguchi, Saitama, JP;
Yoshitaka Toyoda, Satte, JP;
Tsukasa Ohnishi, Souka, JP;
Senju Metal Industry Co., Ltd., Tokyo, JP;
Matsushita Electric Industrial Co., Ltd, Kadoma, JP;
Abstract
The present invention provides a Sn—Zn based lead-free solder which can prevent peeling of solder from soldered portions even after the passage of long periods after soldering of portions to be soldered made of Cu. A Sn—Zn based lead-free solder according to the present invention comprises 5-10 mass percent of Zn, a total of 0.005-1.0 mass percent of at least one substance selected from the group consisting of Au, Pt, Pd, Fe, and Sb, optionally a total of at most 15 mass percent of at least one substance selected from the group consisting of Bi and In, and a remainder of Sn. This Sn—Zn based lead-free solder can be made into a solder paste using a rosin flux containing a halide such as an amine hydrochloride as an activator.