The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 09, 2007

Filed:

Nov. 15, 2004
Applicants:

Kenji Shinma, Itami, JP;

Hirohiko Nakata, Itami, JP;

Masuhiro Natsuhara, Itami, JP;

Inventors:

Kenji Shinma, Itami, JP;

Hirohiko Nakata, Itami, JP;

Masuhiro Natsuhara, Itami, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 31/02 (2006.01); H01L 21/68 (2006.01); C23C 16/00 (2006.01); C23C 16/458 (2006.01);
U.S. Cl.
CPC ...
Abstract

To provide a semiconductor manufacturing device, which is provided with a wafer holder capable of improving the cooling rate of a heater and retaining the homogeneity of the temperature distribution of the heater at cooling time and which can markedly shorten the time period for treating a semiconductor wafer. The wafer holder includes the heaterfor carrying the semiconductor wafer thereon to heat the same, and the cooling blockfor cooling the heater. The cooling blockis arranged so as to come into and out of abutment against the backof the heater on the side opposed to the wafer carrying face, and its abutment faceto abut against the heaterhas a warpage of 1 mm or less. The cooling blockcan be provided therein with a passage for a cooling liquid. It is preferred that the passage has a sectional area of 1 mmor larger over 80% of its entire length, and that the area of the portion having the passage formed is 3% or larger of the entire area of the abutment face


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