The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 25, 2007
Filed:
May. 19, 2005
Hani S. Attalla, Boise, ID (US);
Mark Bunn, Caldwell, ID (US);
Hani S. Attalla, Boise, ID (US);
Mark Bunn, Caldwell, ID (US);
Micron Technology, Inc., Boise, ID (US);
Abstract
A method and system for testing a plurality of semiconductor dice on a semiconductor wafer during burn-in includes forming a plurality of semiconductor dice with each die including an integrated circuit and built-in self stress circuitry coupled thereto. The built-in self stress circuitry includes contacts coupled thereto that are configured for probing by a probe card on a burn-in tester. The built-in self stress circuitry, through an interface with the integrated circuit, generates signals for exercising the operation of the integrated circuit during burn-in testing. Each of the plurality of semiconductor dice on the semiconductor wafer are individually controllable by the burn-in tester.