The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 11, 2007
Filed:
May. 16, 2003
Applicants:
David H. Gracias, Portland, OR (US);
Chih-i Wu, Hillsboro, OR (US);
Inventors:
David H. Gracias, Portland, OR (US);
Chih-I Wu, Hillsboro, OR (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/445 (2006.01);
U.S. Cl.
CPC ...
Abstract
Embodiments of the present invention provide methods to reduce the copper line roughness for increased electrical conductivity in narrow interconnects having a width of less than 100 nm. These methods reduce the copper line roughness by first smoothing the surface on which the copper lines are formed by performing a short electrochemical etch of the surface. The electrical conductivity of the interconnects is increased by reducing the copper line roughness that in turn reduces the resistivity of the copper lines.