The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 28, 2007
Filed:
May. 13, 2005
Shohei Shima, Tokyo, JP;
Akira Fukunaga, Tokyo, JP;
Shohei Shima, Tokyo, JP;
Akira Fukunaga, Tokyo, JP;
Ebara Corporation, Tokyo, JP;
Abstract
A method for polishing a thin film formed on a substrate includes planarizing a thin film formed on a reference substrate by a CMP process such that the thin film remains on the reference substrate. After the planarizing, the thin film is cleaned, and then values of Δ and Ψ with respect to the cleaned thin film are measured by ellipsometry. A physical property of the thin film is determined based on the Δ and Ψ which have been measured by ellipsometry, and a polishing condition for an other substrate having a thin film to be polished is set based on physical property data which are obtained by the determining of the physical property.