The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 21, 2007

Filed:

Apr. 21, 2005
Applicants:

Katsuaki Natori, Yokohama, JP;

Keisuke Nakazawa, Tokyo, JP;

Koji Yamakawa, Tokyo, JP;

Hiroyuki Kanaya, Yokohama, JP;

Yoshinori Kumura, Yokohama, JP;

Hiroshi Itokawa, Yokohama, JP;

Osamu Arisumi, Yokohama, JP;

Inventors:

Katsuaki Natori, Yokohama, JP;

Keisuke Nakazawa, Tokyo, JP;

Koji Yamakawa, Tokyo, JP;

Hiroyuki Kanaya, Yokohama, JP;

Yoshinori Kumura, Yokohama, JP;

Hiroshi Itokawa, Yokohama, JP;

Osamu Arisumi, Yokohama, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01); C23C 16/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

An apparatus for manufacturing a semiconductor device is disclosed which comprises a chamber which holds a to-be-processed substrate having a film containing at least one kind of metal element which will become a component of a volatile metal compound, a heater which heats the substrate held in the chamber, and an adsorbent which is provided in the chamber and which adsorbs the volatile metal compound generated from the film by heating the substrate.


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