The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 21, 2007

Filed:

Mar. 09, 2005
Applicants:

Hideo Aoki, Yokohama, JP;

Yoshiaki Sugizaki, Oita, JP;

Naoko Yamaguchi, Yokohama, JP;

Chiaki Takubo, Tokyo, JP;

Inventors:

Hideo Aoki, Yokohama, JP;

Yoshiaki Sugizaki, Oita, JP;

Naoko Yamaguchi, Yokohama, JP;

Chiaki Takubo, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

According to one aspect of the present invention, a semiconductor device, comprising a wiring board provided with wires and electrodes; a semiconductor element which is mounted on the wiring board and has plural connection electrodes formed on its surface; and a metal layer of fine metal particles aggregated and bonded which is interposed between the electrodes on the wiring board and the connection electrodes of the semiconductor element to connect between the electrodes and the connection electrodes, is provided.


Find Patent Forward Citations

Aoki, Hideo. (2007). Semiconductor device and manufacturing method thereof (U.S. Patent No. 7259046). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7259046

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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