The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7256136 B1

PDF
Full Text
Expired
Date of Patent:
Aug. 14, 2007

Filed:

Feb. 02, 2006
Applicants:

Wuping Liu, Singapore, SG;

Bei Chao Zhang, S'pore, SG;

Liang Choo Hsia, Singapore, SG;

Inventors:

Wuping Liu, Singapore, SG;

Bei Chao Zhang, S'pore, SG;

Liang Choo Hsia, Singapore, SG;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/64 (2006.01);
U.S. Cl.
CPC ...
Abstract

In accordance with the objectives of the invention a new method is provided for the creation of an interconnect pattern. The invention provides for a layer of Photo-Active Dielectric (PAD) to be used for the insulation material in which the interconnect pattern is created, this without the use of an overlying exposure mask of photoresist.


Find Patent Forward Citations

Liu, Wuping. (2007). Self-patterning of photo-active dielectric materials for interconnect isolation (U.S. Patent No. 7256136). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7256136

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