Semiconductor multipackage module including die and inverted land grid array package stacked over ball grid array package

Abstract

A multipackage module has multiple die of various types and having various functions and, in some embodiments, the module includes a digital processor, an analog device, and memory. A first die, having a comparatively large footprint, is mounted onto first die attach region on a surface of a first package substrate. A second die, having a significantly smaller footprint, is mounted upon the surface of the first die, on a second die attach region toward one edge of the first die. The first die is electrically connected by wire bonds to conductive traces in the die-attach side of the substrate. The second die is electrically connected by wire bonds to the first package substrate, and may additionally be electrically connected by wire bonds to the first die. In some embodiments a spacer is mounted upon the first die, on a spacer attach region of the surface of the first die that is not within the die attach region, and which may be generally near a margin of the first die. A land grid array (LGA) package is inverted and mounted upon the spacer, with one margin of the LGA package near the edge of the spacer, so that much of the LGA package overhangs the second die. In other embodiments an additional spacer is mounted upon the first die, on a second spacer attach region that is not within the die attach region and not within the first spacer attach region, and the inverted LGA package is mounted upon both spacers. In still other embodiments a first spacer having a thickness approximating the thickness of the second die is mounted in a spacer attach region upon the first die; additional spacers are mounted upon both the first spacer and the second die, and the inverted LGA package is mounted upon the additional spacers. The LGA package is electrically connected to the first package substrate by wire bonds between bond sites on the LGA package and bond sites on the BGA package.