The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 24, 2007

Filed:

Dec. 02, 2003
Applicants:

Diane C. Boyd, LaGrangeville, NY (US);

Bruce B. Doris, Brewster, NY (US);

Meikei Ieong, Wappingers Falls, NY (US);

Devendra K. Sadana, Pleasantville, NY (US);

Inventors:

Diane C. Boyd, LaGrangeville, NY (US);

Bruce B. Doris, Brewster, NY (US);

Meikei Ieong, Wappingers Falls, NY (US);

Devendra K. Sadana, Pleasantville, NY (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/302 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention comprises a method for forming an ultra-thin channel MOSFET and the ultra-thin channel MOSFET produced therefrom. Specifically, the method comprises providing an SOI substrate having a buried insulating layer underlying an SOI layer; forming a pad stack atop the SOI layer; forming a block mask having a channel via atop the pad stack; providing a localized oxide region in the SOI layer on top of the buried insulating layer thereby thinning a portion of the SOI layer, the localized oxide region being self-aligned with the channel via; forming a gate in the channel via; removing at least the block mask; and forming source/drain extensions in the SOI layer abutting the thinned portion of the SOI layer. Providing the localized oxide region further comprises implanting oxygen dopant through the channel via into a portion of the SOI layer; and annealing the dopant to create the localized oxide region.


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