The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 10, 2007
Filed:
Jun. 30, 2005
Yoichi Kobayashi, Kanagawa, JP;
Shunsuke Nakai, Tokyo, JP;
Hitoshi Tsuji, Tokyo, JP;
Yasuo Tsukuda, Osaka, JP;
Hiroki Yamauchi, Shiga, JP;
Yoichi Kobayashi, Kanagawa, JP;
Shunsuke Nakai, Tokyo, JP;
Hitoshi Tsuji, Tokyo, JP;
Yasuo Tsukuda, Osaka, JP;
Hiroki Yamauchi, Shiga, JP;
Ebara Corporation, Tokyo, JP;
Shimadzu Corporation, Kyoto, JP;
Abstract
A substrate polishing apparatus for polishing a polishing surface of a substrate has a film thickness monitoring device for monitoring a state of a film thickness of a thin film on the polishing surface of the substrate during polishing. The apparatus includes a table, a polishing member fixed on a surface of the table, a substrate support member for pressing the substrate onto the polishing member, an optical system composed of an optical fiber for irradiating the polishing surface of the substrate with a light of irradiation and an optical fiber for receiving a reflected light reflected on the polishing surface of the substrate, an analysis-processing system for processing an analysis of the reflected light received with the optical system, and the film-thickness monitoring device. The table is provided with a liquid-feeding opening for feeding a translucent liquid into a through-hole disposed in the polishing member.