The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 26, 2007
Filed:
Apr. 27, 2004
Christophe Maleville, La Terrasse, FR;
Corinne Maunand Tussot, Meylan, FR;
Olivier Rayssac, Grenoble, FR;
Sébastien Kerdiles, Saint-Ismier, FR;
Benjamin Scarfogliere, Grenoble, FR;
Hubert Moriceau, Saint Egrève, FR;
Christophe Morales, Pont de Claix, FR;
Christophe Maleville, La Terrasse, FR;
Corinne Maunand Tussot, Meylan, FR;
Olivier Rayssac, Grenoble, FR;
Sébastien Kerdiles, Saint-Ismier, FR;
Benjamin Scarfogliere, Grenoble, FR;
Hubert Moriceau, Saint Egrève, FR;
Christophe Morales, Pont de Claix, FR;
S.O.I.Tec Silicon on Insulator Technologies, Bernin, FR;
Commissariat à l'Energie Atomique (CEA), Paris, FR;
Abstract
A method for bonding semiconductor structures together is described. The technique includes providing a bonding surface on each of two semiconductor structures, brushing a bonding surface of at least one of the structures to remove contaminants and to activate hydroxyl groups on the bonding surface to enhance hydrophilicity and to facilitate molecular bonding of the structures, and joining the bonding surfaces together by molecular bonding to form a composite structure.