The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 26, 2007
Filed:
Dec. 10, 2001
Applicants:
Hirofumi Kitayama, Nirasaki, JP;
Noriaki Matsushima, Nirasaki, JP;
Inventors:
Hirofumi Kitayama, Nirasaki, JP;
Noriaki Matsushima, Nirasaki, JP;
Assignee:
Tokyo Electron Limited, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/302 (2006.01); C23C 16/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
A single-substrate processing apparatus () has a worktable () disposed in a process chamber (), which accommodates a target substrate (W). The worktable () has a thermally conductive mount surface () to place the target substrate (W) thereon. The worktable () is provided with a flow passage () formed therein, in which a thermal medium flows for adjusting temperature of the target substrate (W) through the mount surface (). The flow passage () is connected to a thermal medium supply system (), which selectively supplies a cooling medium and a heating medium.
Published as:
WO02059953A1; JP2002217178A; KR20030074713A; US2004097088A1; US7235137B2; KR100842948B1; JP4644943B2;