The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 26, 2007
Filed:
Nov. 15, 2006
Kunihiko Sakurai, Tokyo, JP;
Tetsuji Togawa, Tokyo, JP;
Yoshihiro Mochizuki, Fujisawa, JP;
Akira Fukuda, Fujisawa, JP;
Hirokuni Hiyama, Fujisawa, JP;
Kazuto Hirokawa, Tokyo, JP;
Manabu Tsujimura, Tokyo, JP;
Kunihiko Sakurai, Tokyo, JP;
Tetsuji Togawa, Tokyo, JP;
Yoshihiro Mochizuki, Fujisawa, JP;
Akira Fukuda, Fujisawa, JP;
Hirokuni Hiyama, Fujisawa, JP;
Kazuto Hirokawa, Tokyo, JP;
Manabu Tsujimura, Tokyo, JP;
Ebara Corporation, Tokyo, JP;
Abstract
A polishing method can automatically reset polishing conditions according to a state of a polishing member based on data on a polishing profile changing with time, thereby extending life of the polishing member and obtaining flatness of a polished surface with higher accuracy. The polishing method, includes steps of: independently applying a desired pressure by each of pressing portions of a top ring on a polishing object; estimating a polishing profile of the polishing object based on set pressure values, and calculating a recommended polishing pressure value so that a difference between the polishing profile of the polishing object after it is polished under certain polishing conditions and a desired polishing profile becomes smaller; and polishing the polishing object with the recommended polishing pressure value.