The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 12, 2007
Filed:
Oct. 04, 2004
Jerome L. Cann, Jericho, VT (US);
Steven J. Holmes, Guilderland, NY (US);
Leendert M. Huisman, South Burlington, VT (US);
Cherie R. Kagan, Ossining, NY (US);
Leah M. Pastel, Ossining, NY (US);
Paul W. Pastel, Essex, VT (US);
James R. Salimeno, Iii, Fairfax, VT (US);
David P. Vallett, Fairfax, VT (US);
Jerome L. Cann, Jericho, VT (US);
Steven J. Holmes, Guilderland, NY (US);
Leendert M. Huisman, South Burlington, VT (US);
Cherie R. Kagan, Ossining, NY (US);
Leah M. Pastel, Ossining, NY (US);
Paul W. Pastel, Essex, VT (US);
James R. Salimeno, III, Fairfax, VT (US);
David P. Vallett, Fairfax, VT (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
The present invention provides inspection methods and structures for facilitating the visualization and/or detection of specific chip structures. Optical or fluorescent labeling techniques are used to 'stain' a specific chip structure for easier detection of the structure. Also, a temporary/sacrificial illuminating (e.g., fluorescent) film is added to the semiconductor process to facilitate the detection of a specific chip structure. Further, a specific chip structure is doped with a fluorescent material during the semiconductor process. A method of the present invention comprises: providing a first and a second material; processing the first material to form a portion of a semiconductor structure; and detecting a condition of the second material to determine whether processing of the first material is complete.