The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 22, 2007

Filed:

Oct. 06, 2005
Applicants:

Min-lung Huang, Kao-Hsiung, TW;

Tsung-hua Wu, Kao-Hsiung Hsien, TW;

Inventors:

Min-Lung Huang, Kao-Hsiung, TW;

Tsung-Hua Wu, Kao-Hsiung Hsien, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
Abstract

A chip scale package with micro antenna includes a chip, a first dielectric layer and an antenna. The chip has an active surface, a first bonding pad and a second bonding pad on the active surface. The first dielectric layer is formed on the active surface of the chip. The first dielectric layer has a plurality of openings to expose the first bonding pad and the second bonding pad. Each of the openings has an expanding inclined sidewall. The antenna is formed on the upper surface of the first dielectric layer and connected to the first bonding pad and the second bonding pad through the inclined sidewall of the openings for preventing antenna cracking.


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