The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 22, 2007
Filed:
Jan. 18, 2005
Jeffrey D. Gelorme, Burlington, CT (US);
Supratik Guha, Chappaqua, NY (US);
Nancy C. Labianca, Yalesville, CT (US);
Yves Martin, Ossining, NY (US);
Theodore G. Van Kessel, Millbrook, NY (US);
Jeffrey D. Gelorme, Burlington, CT (US);
Supratik Guha, Chappaqua, NY (US);
Nancy C. LaBianca, Yalesville, CT (US);
Yves Martin, Ossining, NY (US);
Theodore G. Van Kessel, Millbrook, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
The present invention is a thermal interface for coupling a heat source to a heat sink. One embodiment of the invention comprises a mesh and a liquid, e.g., a thermally conductive liquid, disposed in the mesh. The mesh and the thermally conductive liquid are adapted to contact both the heat source and the heat sink when disposed therebetween. In one embodiment, the mesh may comprise a metal or organic material compatible with the liquid. In one embodiment, the liquid may comprise liquid metal. For example, the liquid may comprise a gallium indium tin alloy. A gasket may optionally be used to seal the mesh and the liquid between the heat source and the heat sink. In one embodiment, the heat source is an integrated circuit chip.