The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 01, 2007
Filed:
Aug. 22, 2005
Yan Wang, Sunnyvale, CA (US);
Stan D. Tsai, Fremont, CA (US);
Yongqi HU, San Jose, CA (US);
Feng Q. Liu, San Jose, CA (US);
Liang-yuh Chen, Foster City, CA (US);
Daxin Mao, Cupertino, CA (US);
Huyen Karen Tran, San Jose, CA (US);
Martin S. Wohlert, San Jose, CA (US);
Renhe Jia, Berkeley, CA (US);
Yuan A. Tian, San Jose, CA (US);
Yan Wang, Sunnyvale, CA (US);
Stan D. Tsai, Fremont, CA (US);
Yongqi Hu, San Jose, CA (US);
Feng Q. Liu, San Jose, CA (US);
Liang-Yuh Chen, Foster City, CA (US);
Daxin Mao, Cupertino, CA (US);
Huyen Karen Tran, San Jose, CA (US);
Martin S. Wohlert, San Jose, CA (US);
Renhe Jia, Berkeley, CA (US);
Yuan A. Tian, San Jose, CA (US);
Applied Materials, Inc., Santa Clara, CA (US);
Abstract
Embodiments of a conditioning head for in-situ conditioning and/or cleaning a processing pad of a CMP, ECMP, or other processing system are provided. In one embodiment, the conditioning head includes a brush disposed in a central cavity. A cleaning fluid is provided through the central cavity of the conditioning head to a processing pad. The brush spins and moves laterally across the surface of the processing pad. The cleaning solution dispensed through the conditioning head dissolves by-products of the processing operation while the brush gently wipes the processing pad. A lip of the conditioning head retains the cleaning fluid and cleaning waste, thereby minimizing contamination of the area outside of the conditioning head. The cleaning waste is removed from the processing pad via passages formed near the outer periphery of the conditioning head.