The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 24, 2007
Filed:
Apr. 25, 2001
Satoyuki Nomura, Tsukuba, JP;
Tohru Fujinawa, Tsukuba, JP;
Hiroshi Ono, Tsukuba, JP;
Hoko Kanazawa, Tsukuba, JP;
Masami Yusa, Tsukuba, JP;
Satoyuki Nomura, Tsukuba, JP;
Tohru Fujinawa, Tsukuba, JP;
Hiroshi Ono, Tsukuba, JP;
Hoko Kanazawa, Tsukuba, JP;
Masami Yusa, Tsukuba, JP;
Hitachi Chemical Co., Ltd., Tokyo, JP;
Abstract
There are provided an adhesive for connecting a circuit to be interposed between substrates having circuit electrodes thereon opposed to each other and to electrically connect the circuit electrodes on the substrates opposed to each other to the pressurizing direction under pressure, wherein the adhesive contains a compound having an acid equivalent of 5 to 500 KOH mg/g, and an adhesive for connecting a circuit to be interposed between substrates having circuit electrodes opposed to each other and to electrically connect the electrodes on the substrate opposed to each other to the pressurizing direction under pressure, wherein the adhesive comprises a first adhesive layer and a second adhesive layer, and a glass transition temperature of the first adhesive layer after pressure connection is higher than the glass transition temperature of the second adhesive layer after pressure connection.