The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 17, 2007
Filed:
Apr. 23, 2004
Chin-tien Chiu, Taichung, TW;
Chin-huang Chang, Taichung, TW;
Chih-ming Huang, Taichung, TW;
Siliconware Precision Industries Co., Ltd., Tantzu, Taichung, TW;
Abstract
A printed circuit board and a method for fabricating the same is provided. A substrate having a core layer and a plurality of pairs of bond pads thereon is prepared with at least one opening formed on the core layer between each pair of the bond pads. A solder mask layer covers the core layer and fills the openings, with recessed portions formed at positions of the solder mask layer on the openings during curing of the solder mask layer. When a small passive component is mounted on the printed circuit board, a space is formed between the bottom of the passive component and the recessed portions of the solder mask layer. An encapsulating resin can flow into the space to form an insulating barrier between the bond pads to prevent bridging between the bond pads and short circuiting of the passive component.