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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7202951 B1

PDFFull Text
Date of Patent:
Apr. 10, 2007

Filed:

Oct. 28, 2004

Laser-based cleaning device for film analysis tool

Applicants:

Gary R. Janik, Palo Alto, CA (US);

Patrick M. Maxton, San Jose, CA (US);

Inventors:

Gary R. Janik, Palo Alto, CA (US);

Patrick M. Maxton, San Jose, CA (US);

Assignee:

KLA-Tencor Technologies Corporation, Milpitas, CA (US);

Attorneys:

Bever, Hoffman & Harms, LLP

Jeanette S. Harms

Primary Examiner:

Gregory J Toatley, Jr

Assistant Examiner:

Gordon J Stock, Jr

Int. Cl.
CPC ...
G01J 4/00 (2006.01); G01N 21/55 (2006.01); G01N 23/00 (2006.01); G01N 21/86 (2006.01); G01N 23/223 (2006.01); G01N 23/20 (2006.01); G01B 11/30 (2006.01); G01B 11/24 (2006.01); G01B 11/28 (2006.01); G01B 15/02 (2006.01); G02F 1/01 (2006.01); H01J 40/14 (2006.01); G21K 7/00 (2006.01); G01V 8/00 (2006.01); G01R 31/26 (2006.01); G01R 27/26 (2006.01); G01R 31/305 (2006.01); G01R 31/302 (2006.01); H01L 21/66 (2006.01); G01T 1/36 (2006.01); B08B 3/12 (2006.01); B08B 6/00 (2006.01); B08B 7/00 (2006.01); B08B 7/02 (2006.01); C25F 1/00 (2006.01); C25F 3/30 (2006.01); C25F 5/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A system for analyzing a thin film uses an energy beam, such as a laser beam, to remove a portion of a contaminant layer formed on the thin film surface. This cleaning operation removes only enough of the contaminant layer to allow analysis of the underlying thin film, thereby enhancing analysis throughput while minimizing the chances of recontamination and/or damage to the thin film. An energy beam source can be readily incorporated into a conventional thin film analysis tool, thereby minimizing total analysis system footprint. Throughput can be maximized by focusing the probe beam (or probe structure) for the analysis operation at the same location as the energy beam so that repositioning is not required after the cleaning operation. Alternatively, the probe beam (structure) and the energy beam can be directed at different locations to reduce the chances of contamination of the analysis optics.

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