The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 10, 2007
Filed:
Nov. 08, 2004
Chung-min Fu, Chungli, TW;
Huang-sheng Lin, Hsin-Chu, TW;
Yu-chyi Harn, Bao-Shan, TW;
Hsien-wei Chen, Sinying, TW;
Chung-min Fu, Chungli, TW;
Huang-Sheng Lin, Hsin-Chu, TW;
Yu-Chyi Harn, Bao-Shan, TW;
Hsien-Wei Chen, Sinying, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Abstract
A semiconductor die having an integrated circuit region formed in a substrate comprises at least one die-corner-circuit-forbidden (DCCF) region disposed in the substrate, proximate to the integrated circuit region; and at least one registration feature formed within the at least one DCCF region. The at least one registration feature comprises a structure selected from the group consisting of a laser fuse mark, an alignment mark, and a monitor mark.