Memory card and its manufacturing method

Abstract

A memory card comprising a die paddle having opposed, generally planar first and second die paddle surfaces and multiple peripheral edge segments. Disposed along and in spaced relation to one of the peripheral edge segments of the die paddle is a plurality of contacts, each of which has opposed, generally planar first and second contact surfaces. An inner body partially encapsulates the die paddle and the contacts, the first contact surface of each of the contacts and the first die paddle surface of the die paddle being exposed in and substantially flush with a generally planar first inner body surface of the inner body. The inner body further defines a generally planar second inner body surface which is disposed in opposed relation to the first inner body surface, the second contact surface of each of the contacts being exposed in the second inner body surface. At least one electronic circuit element is attached to the first die paddle surface and electrically connected to at least one of the contacts. An outer body partially encapsulates the inner body such that the first die paddle surface, the first contact surface of each of the contacts, the first inner body surface and the electronic circuit element are covered by the outer body, with the second inner body surface and hence the second contact surface of each of the contacts not being covered by the outer body and thus exposed.