The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 13, 2007
Filed:
Nov. 03, 2005
Panayotis C. Andricacos, Croton-On-Hudson, NY (US);
Shyng-tsong Chen, Patterson, NY (US);
John M. Cotte, New Fairfield, CT (US);
Hariklia Deligianni, Tenafly, NJ (US);
Mahadevaiyer Krishnan, Hopewell Junction, NY (US);
Wei-tsu Tseng, Hopewell Junction, NY (US);
Philippe M. Vereecken, Leuven, BE;
Panayotis C. Andricacos, Croton-On-Hudson, NY (US);
Shyng-Tsong Chen, Patterson, NY (US);
John M. Cotte, New Fairfield, CT (US);
Hariklia Deligianni, Tenafly, NJ (US);
Mahadevaiyer Krishnan, Hopewell Junction, NY (US);
Wei-Tsu Tseng, Hopewell Junction, NY (US);
Philippe M. Vereecken, Leuven, BE;
International Business Machines Corporation, Armonk, NY (US);
Abstract
Patterned copper structures are fabricated by selectively capping the copper employing selective etching and/or selective electroplating in the presence of a liner material. Apparatus for addressing the problem of an increased resistive path as electrolyte during electroetching and/or electroplating flows from the wafer edge inwards is provided.