The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 13, 2007
Filed:
Aug. 30, 2005
Chun-wen Cheng, Hsinchu, TW;
Chia-wen Liang, Hsinchu, TW;
Ruey-chyr Lee, Taichung, TW;
Sheng-yuan Hsueh, Baoshan Township, Hsinchu County, TW;
Chun-Wen Cheng, Hsinchu, TW;
Chia-Wen Liang, Hsinchu, TW;
Ruey-Chyr Lee, Taichung, TW;
Sheng-Yuan Hsueh, Baoshan Township, Hsinchu County, TW;
United Microelectronics Corp., Hsinchu, TW;
Abstract
A fuse structure for a semiconductor device is provided. The fuse structure includes a fuse layer between the upper and bottom insulating layers. The fuse layer is connected to the other metal layers through via plugs. The fuse layer includes separate blocks and at least a connecting block and is coupled to at least a heat buffer block of a different layer. Because the heat buffer block is coupled to the blocks of the fuse layer, new fusing point and a new path for effectively dissipating the heat are provided and a longer and sinuous electric current path is obtained between the blocks through the heat buffer blocks. The heat buffer block and the blocks coupled to the heat buffer block can avoid large current flowing through the fuse structure and prevent overheating.